> For the complete documentation index, see [llms.txt](https://docs.morsemicro.com/llms.txt). Markdown versions of documentation pages are available by appending `.md` to page URLs; this page is available as [Markdown](https://docs.morsemicro.com/datasheets/mm8108-m20-preliminary-data-sheet.md). # MM8108-M20 Preliminary Data Sheet [Download as PDF](https://morse-micro.gitbook.io/morse-micro-docs-v.2/Y6X5n1UqJsVJ6qPvXX2V/data-sheets/mm8108-m20-preliminary-data-sheet) ## 1 Product Overview ### 1.1 Introduction Wi-Fi HaLow (pronounced “HEY-low”) is the first global Wi-Fi standard (IEEE 802.11ah) specifically designed for the Internet of Things (IoT). It’s an open-standard wireless network technology operating in the sub-1 GHz license-exempt RF bands (850-950 MHz range), so it doesn’t incur ongoing monthly costs like cellular/mobile network connections. By operating in the sub-1 GHz range, this low-power wireless protocol can connect more IoT devices over much longer distances and with significantly lower power than traditional Wi-Fi. Morse Micro, the world’s leading Wi-Fi HaLow solutions provider, offers several Wi-Fi HaLow connectivity solutions. The MM8108-M20 is a fully integrated, high-power Wi-Fi HaLow module with long-range and excellent RF performance, featuring our second-generation MM8108 Wi-Fi HaLow SoCs. The MM8108-M20-US module combines our world-leading MM8108 with a powerful external power amplifier (PA) that provides transmit amplification up to 28.5 dBm and a surface acoustic wave (SAW) filter that offers exceptional receive sensitivity tuned to the 902-928 MHz band. These innovations, combined with digital transmit filtering and pre-distortion circuits, result in an advanced transceiver design that ensures maximum performance and out-of-the-box compatibility with most global Wi-Fi HaLow regulatory environments. MM8108-M20 supports a USB 2.0 High-Speed host interface and an SDIO/SPI host interface, offering solution architects flexibility when integrating Wi-Fi HaLow connectivity into their existing solution. With a footprint of only 18.5 mm x 14 mm, the MM8108-M20 module has been designed to maximize the performance of our second-generation SoCs. MM8108-M20 supports WPA3 and all standard security features required for Wi-Fi HaLow product certifications. ### 1.2 Features * Single-stream maximum PHY rate of 43.3 Mbps at 8 MHz bandwidth * Radio supporting worldwide Sub-1 GHz frequency bands * Frequency range: 902-928 MHz * Channel bandwidth options of 1/2/4/8 MHz * High power PA with a maximum 28.5 dBm (700 mW) output power * Low-power receiver with integrated LNA, NF < 4 dB * 802.11ah OFDM PHY with Wi-Fi Alliance Wi-Fi HaLow certification * BPSK & QPSK, 16-QAM, 64-QAM and 256-QAM Modulation * Automatic frequency and gain control * Packet detection and channel equalization * Forward Error Correction (FEC) coding and decoding * Modulation and Coding Scheme (MCS) levels 0-10 * 1 MHz duplicate mode * Optional traveling pilots * 802.11ah MAC with Wi-Fi Alliance Wi-Fi HaLow certification * Support for Station (STA) and Access Point (AP) roles * Listen-Before-Talk (LBT) access with energy detection * 802.11 power save * 802.11 fragmentation and defragmentation * Power-Saving Target Wake Time (TWT) support for extended battery life * Automatic and manual MCS rate selection * On-chip software stack assisting with host offload of Wi-Fi connection management * USB 2.0 High-Speed compliant device interface * Integrated USB 2.0 PHY and device interface supporting High-Speed mode at 480 Mbps * SDIO 2.0 compliant device interface * SDIO 2.0 High-Speed at 50 MHz max for 200 Mbps * Support for 1-bit and 4-bit data mode * Support for SPI mode operation at up to 80 MHz for 80 Mbps * Power Management Unit (PMU) supporting various modes of operation * A single 3.0-3.6 V supply for integrated DC-DCs and LDOs * A dedicated 5.0 V supply for the PA * Multiple low-power modes to reduce average power consumption * Broad spectrum of security features * Wi-Fi layer security, including Wi-Fi Protected Access version 3 (WPA3), Protected Management Frames (PMF), and Opportunistic Wireless Encryption (OWE) * Hardware support for Advanced Encryption Standard (AES) and Secure Hash Algorithm version 2 (SHA-2) functions (SHA-256, SHA-384, SHA-512) ### 1.3 Applications Ideally suited for Internet of Things (IoT) and Machine-to-Machine (M2M) applications such as: * Surveillance cameras and sensors * Cloud connectivity * Low-power sensor networks * Building automation systems * Asset tracking and management * Machine performance monitors and sensors * Building access control and security * Drone video and navigation communications * Connected toys and games * Rural internet access * Agricultural networks * Utility smart meter and intelligent grid * Proximity sensors * Industrial automation controls * Smart home automation * EV car chargers * Appliances * Construction site connectivity * Smart signs and kiosks * Retail point-of-sale terminals * Vehicle-to-vehicle communications * IP sensor networks * Biometric IDs and keypads * Warehouse connectivity * Intelligent lighting controls * BT/ZigBee™/Z-Wave™ to Wi-Fi HaLow gateways * Wi-Fi to Wi-Fi HaLow bridges * Wi-Fi HaLow client adapters/dongles * Smart city networks ## 2 Pin Descriptions The MM8108-M20 modules feature 51 pins, which are described in this section. The following illustration shows the top view of the module pins. ### 2.1 Default Pin Layout ![Figure 1: Default pin layout diagram](/files/3f7a2fc639638fc82ec3a24ae7ccd97ad405dc9f) *Figure 1: Default pin layout diagram* ### 2.2 Pin Descriptions **Table 1: Pin description** | Pin | Default Function Pin Name | Default Function Type | Default Function Description | Alternate Function Pin Name | | --- | ------------------------- | --------------------- | ---------------------------------------- | --------------------------- | | 1 | GND | Ground | Ground | | | 2 | GND | Ground | Ground | | | 3 | GPIO1 | Digital I/O | Programmable digital I/O | | | 4 | GPIO0 | Digital I/O | Programmable digital I/O | | | 5 | GPIO6 | Digital I/O | Programmable digital I/O | | | 6 | GPIO7 | Digital I/O | Programmable digital I/O | | | 7 | GPIO8 | Digital I/O | Programmable digital I/O | | | 8 | GPIO9 | Digital I/O | Programmable digital I/O | | | 9 | RESET\_N \[2] | Analog | Asynchronous chip reset (active low) | | | 10 | WAKE \[2] | Analog | External wake from Deep Sleep and Snooze | | | 11 | JTAG\_TMS | Digital I/O | JTAG Mode Select | | | 12 | JTAG\_TCK | Digital I/O | JTAG Clock | | | 13 | JTAG\_TDO | Digital I/O | JTAG Data Out | | | 14 | GND | Ground | Ground | | | 15 | JTAG\_TDI | Digital I/O | JTAG Data In | | | 16 | VDD | Supply | 3.3V VDD Supply | | | 17 | SDIO\_D0 \[1] | Digital I/O | SDIO Data line | SPI\_MISO | | 18 | SDIO\_D1 \[1] | Digital I/O | SDIO Data line | SPI\_INT | | 19 | SDIO\_D3 \[1] | Digital I/O | SDIO Data line | SPI\_CS | | 20 | SDIO\_D2 \[1]\[3] | Digital I/O | SDIO Data line | | | 21 | SDIO\_CMD \[1] | Digital I/O | SDIO Command line | SPI\_MOSI | | 22 | SDIO\_CLK | Digital I/O | SDIO Clock input | SPI\_SCK | | 23 | GPIO5 | Digital I/O | Programmable digital I/O | | | 24 | GND | Ground | Ground | | | 25 | GND | Ground | Ground | | | 26 | GPIO4 | Digital I/O | Programmable digital I/O | | | 27 | GPIO3 | Digital I/O | Programmable digital I/O | | | 28 | VDDIO | Supply | Host supply for digital I/O | | | 29 | GND | Ground | Ground | | | 30 | VDD\_TX | Supply | 3.3 V VDD-TX Supply | | | 31 | VDD\_USB | Supply | USB Supply | | | 32 | GND | Ground | Ground | | | 33 | USB\_DN | I/O | USB DN line | | | 34 | USB\_DP | I/O | USB DP line | | | 35 | GND | Ground | Ground | | | 36 | VDD\_EPA | Supply | 5.0 V VDD-EPA Supply | | | 37 | VDD\_EPA | Supply | 5.0 V VDD-EPA Supply | | | 38 | GND | Ground | Ground | | | 39 | GND | Ground | Ground | | | 40 | GND | Ground | Ground | | | 41 | GND | Ground | Ground | | | 42 | GND | Ground | Ground | | | 43 | GND | Ground | Ground | | | 44 | GPIO2 | Digital I/O | Programmable digital I/O | | | 45 | GND | Ground | Ground | | | 46 | GND | Ground | Ground | | | 47 | ANT | Analog | Antenna | | | 48 | GND | Ground | Thermal Ground | | | 49 | GND | Ground | Thermal Ground | | | 50 | GND | Ground | Thermal Ground | | | 51 | GND | Ground | Thermal Ground | | \[1] All SDIO bus pins, except SDIO\_CLK, should be pulled up with a 10 kΩ to 100 kΩ resistor, as per the SDIO standard. \[2] Supplied from the VDD domain. The VDDIO domain drives other digital pins. \[3] Pull up SDIO\_D2 when in SPI or SDIO mode ## 3 Functional Description The following sections describe the module's functions. ### 3.1 Block Diagram ![Figure 2: Functional block diagram](/files/602c004e6d1791756a91973b18c0f9293b9afc44) *Figure 2: Functional block diagram* ### 3.2 Power Supply Requirements Module power is derived from a 3.0 to 3.6 V supply on pins VDD and VDD\_TX, and a 5.0 V supply on pins VDD\_EPA. VDD\_EPA should be supplied from a clean, filtered, and regulated power supply that is not shared with other components. VDDIO sets the module's IO voltage. It has an input voltage range of 2.25 V to 3.6 V and should be connected to the same power supply as the host MCU. There are no strict requirements for power-up sequencing. ### 3.3 USB Host Interface A schematic diagram detailing the USB host interface circuit is shown below: ![Figure 3: USB host interface circuit](/files/7c85100b68c32087e99a93af8c359f8a3b3a862a) *Figure 3: USB host interface circuit* ### 3.4 SDIO Host Interface When selecting a host to interface with the module via the SDIO interface, ensure the host supports SDIO 2.0 and supports SDIO clock speeds up to 50 MHz. Slower clock speeds will impact the maximum achievable throughput. The SDIO data and command lines should be pulled up with resistors ranging from 10 kΩ to 100 kΩ, per the SDIO 2.0 specification. For proper operation and to take advantage of the module’s power-saving features, connect RESET\_N and WAKE to standard digital outputs (CMOS logic levels). The BUSY signal should be connected to a digital input (also CMOS logic levels). Do not use open-collector or open-drain circuits, as they will cause incorrect behavior. In applications where the module must always be on, and power-saving features cannot be used, such as access points, the WAKE pin can be left unconnected, reducing the need for GPIOs on the host processor to only one. A schematic diagram detailing the SDIO host interface circuit using the module’s power-saving features is shown below: ![Figure 4: SDIO host interface circuit using power-saving features](/files/ee98846c4208b6b2a369cf8fbd156a4d160b4c62) *Figure 4: SDIO host interface circuit using power-saving features* A schematic diagram detailing the SDIO host interface circuit for always-on applications is shown below: ![Figure 5: SDIO host interface circuit for always-on applications](/files/59209de09c35288e8382d8ae59b591b2c1e2708f) *Figure 5: SDIO host interface circuit for always-on applications* ### 3.5 SPI Host Interface When selecting a host to interface with the module via the SPI interface, consider the following recommendations to achieve the best throughput: * The host must support level-triggered interrupts. * The host must support full-duplex SPI mode. * The host must support DMA-backed transactions on the SPI bus. Standard SPI can achieve up to 25 Mbps at 50 MHz, but without DMA support, this will be significantly reduced. For example, an SPI interface with an 8-byte buffer per transaction might achieve only 2 Mbps on the SPI bus. For proper operation and to take advantage of the module’s power-saving features, connect RESET and WAKE to standard digital outputs (CMOS logic levels). The BUSY signal should be connected to a digital input (also CMOS logic levels). Do not use open-collector or open-drain circuits, as they will cause incorrect behavior. In applications where the module must always be on and power-saving features cannot be used, such as access points, the WAKE pin can be left unconnected, reducing the need for GPIOs on the host processor to only one. A schematic diagram detailing the SPI host interface circuit using the module’s power-saving features is shown below: ![Figure 6: SPI host interface circuit using power-saving features](/files/c2c9fec556a27519a64614b409f89092a8f4d958) *Figure 6: SPI host interface circuit using power-saving features* A schematic diagram detailing the SPI host interface circuit for always-on applications is shown below: ![Figure 7: SPI host interface circuit for always-on applications](/files/8b1d092dd8f7bcaf355e1722eed536193e0d16e5) *Figure 7: SPI host interface circuit for always-on applications* ### 3.6 Boot/Reset Sequencing #### 3.6.1 Boot Timing ![Figure 8: Powering on and reset timing diagram](/files/7c5deff043d8d2b23b0142bdd164949fd0741856) *Figure 8: Powering on and reset timing diagram* **Table 2: Boot timing overview** | Parameters | Description | Min | Max | Unit | | ---------- | --------------------------------------------------------------- | --- | --- | ---- | | V IL\_nRST | Reset threshold | 450 | | mV | | t 0 | Time between VDD brought up (3.3V) and RESET\_N being activated | 50 | | μs | | t B | Boot Time | | 10 | ms | #### 3.6.2 Reset Timing ![Figure 9: Powering on and reset timing diagram](/files/0ab4c4cb4420c8db8bad656ca6e55dac96c7662f) *Figure 9: Powering on and reset timing diagram* **Table 3: Reset timing overview** | Parameters | Description | Min | Max | Unit | | ---------- | --------------------------------------------------------------- | ---- | --- | ---- | | V IL\_nRST | Reset threshold | 450 | | mV | | t 1 | Duration of RESET\_N signal level < VIL\_nRST to reset the chip | 1000 | | μs | | t B | Boot Time | | 10 | ms | ## 4 Electrical Characteristics ### 4.1 Absolute Maximum Ratings Stress beyond absolute maximum ratings may cause permanent damage to the module. Operation is guaranteed only within the recommended operating conditions. Operation of the device outside the recommended conditions may result in reduced lifetime and reliability issues, even if the absolute maximum ratings are not exceeded. **Table 4: Absolute maximum and minimum voltage ratings** | Parameter | Min | Max | Unit | | ------------------- | ---- | ---- | ---- | | VDD voltage | -0.3 | 3.6 | V | | VDD\_TX voltage | -0.3 | 3.6 | V | | VDD\_EPA voltage | -0.3 | 5.25 | V | | RESET\_N/WAKE | -0.3 | 3.6 | V | | VDDIO | -0.3 | 3.6 | V | | Analog/RF pin | -0.3 | 1.2 | V | | Storage temperature | -40 | 125 | °C | | RF input power (CW) | - | 6 | dBm | ### 4.2 ESD Immunity **Table 5: ESD immunity specifications** | Parameter | Parameter | Parameter | Min | Max | Unit | | ----------------------------------------- | ----------------------------------------------------- | ------------------------ | ------ | ----- | ---- | | Electrostatic discharge (ESD) performance | Human body model (HBM), per ANSI / ESDA / JEDEC JS001 | RF Input | -1,000 | 1,000 | V | | Electrostatic discharge (ESD) performance | Human body model (HBM), per ANSI / ESDA / JEDEC JS001 | All pins except RF Input | -2000 | 2000 | V | | Electrostatic discharge (ESD) performance | Charged device model (CDM), per JESD22-C101 | All pins | -500 | 500 | V | ### 4.3 Recommended Operating Conditions **Table 6: Recommended operating conditions** | Parameter | Min | Typ | Max | Unit | | ------------------- | ---- | --- | ---- | ---- | | Ambient temperature | -40 | | 85 | °C | | Storage temperature | -40 | | 125 | °C | | VDD | 3.0 | 3.3 | 3.6 | V | | VDD\_TX | 3.0 | 3.3 | 3.6 | V | | VDD\_EPA | 4.85 | 5.0 | 5.25 | V | | VDDI O | 2.25 | 3.3 | 3.6 | V | ### 4.4 Power Consumption #### 4.4.1 Active Transmit Current Consumption **Table 7: Transmit current consumption for VDD, VDD\_TX, and VDD\_EPA** | MCS Index | Current consumption (mA) per BW at V DD 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 1 MHz | Current consumption (mA) per BW at V DD 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 2 MHz | Current consumption (mA) per BW at V DD 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 4 MHz | Current consumption (mA) per BW at V DD 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 8 MHz | Current consumption (mA) per BW at V DD\_TX 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 1 MHz | Current consumption (mA) per BW at V DD\_TX 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 2 MHz | Current consumption (mA) per BW at V DD\_TX 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 4 MHz | Current consumption (mA) per BW at V DD\_TX 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 8 MHz | Current consumption (mA) per BW at V DD\_EPA 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 1 MHz | Current consumption (mA) per BW at V DD\_EPA 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 2 MHz | Current consumption (mA) per BW at V DD\_EPA 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 4 MHz | Current consumption (mA) per BW at V DD\_EPA 100% duty cycle, T A =25 o C, V DD = V DDIO = V DD\_TX =3.3 V , V DD\_EPA =5.0 V 8 MHz | | --------- | ------------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------------ | ---------------------------------------------------------------------------------------------------------------------------------- | ---------------------------------------------------------------------------------------------------------------------------------- | ---------------------------------------------------------------------------------------------------------------------------------- | ---------------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------------- | | 0 | 28 | 30 | 35 | 45 | 9 | 8 | 8 | 8 | 500 | 465 | 450 | 445 | | 7 | 26 | 29 | 34 | 43 | 9 | 8 | 8 | 8 | 280 | 285 | 295 | 295 | | 9 | 26 | N/A | 34 | 43 | 9 | N/A | 8 | 8 | 240 | N/A | 260 | 260 | #### 4.4.2 Active Receive Current Consumption **Table 8: Active receive current consumption** | MCS Index | Current consumption (mA) per BW at (V DD + V DD\_TX + V DDIO + V DD\_EPA ) 100% duty cycle, T A =25 o C, V DD =V DD\_TX = V DDIO =3.3 V, V DD\_EPA =5.0 V, Rx signal at -70 dBm 1 MHz | Current consumption (mA) per BW at (V DD + V DD\_TX + V DDIO + V DD\_EPA ) 100% duty cycle, T A =25 o C, V DD =V DD\_TX = V DDIO =3.3 V, V DD\_EPA =5.0 V, Rx signal at -70 dBm 2 MHz | Current consumption (mA) per BW at (V DD + V DD\_TX + V DDIO + V DD\_EPA ) 100% duty cycle, T A =25 o C, V DD =V DD\_TX = V DDIO =3.3 V, V DD\_EPA =5.0 V, Rx signal at -70 dBm 4 MHz | Current consumption (mA) per BW at (V DD + V DD\_TX + V DDIO + V DD\_EPA ) 100% duty cycle, T A =25 o C, V DD =V DD\_TX = V DDIO =3.3 V, V DD\_EPA =5.0 V, Rx signal at -70 dBm 8 MHz | | --------- | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- | | 0 | 18 | 19 | 23 | 31 | | Max | 18 (MCS9) | 20 (MCS8) | 24 (MCS9) | 34 (MCS9) | #### 4.4.3 Listen Receive Current Consumption **Table 9: Listen receive current consumption** | Current consumption (mA) per BW at (V DD + V DD\_TX + V DDIO +V DD\_EPA ) 100% duty cycle, T A =25 o C, V DD =V DD\_TX = V DDIO =3.3 V, V DD\_EPA =5.0 V, Rx signal at -70 dBm 1 MHz | Current consumption (mA) per BW at (V DD + V DD\_TX + V DDIO +V DD\_EPA ) 100% duty cycle, T A =25 o C, V DD =V DD\_TX = V DDIO =3.3 V, V DD\_EPA =5.0 V, Rx signal at -70 dBm 2 MHz | Current consumption (mA) per BW at (V DD + V DD\_TX + V DDIO +V DD\_EPA ) 100% duty cycle, T A =25 o C, V DD =V DD\_TX = V DDIO =3.3 V, V DD\_EPA =5.0 V, Rx signal at -70 dBm 4 MHz | Current consumption (mA) per BW at (V DD + V DD\_TX + V DDIO +V DD\_EPA ) 100% duty cycle, T A =25 o C, V DD =V DD\_TX = V DDIO =3.3 V, V DD\_EPA =5.0 V, Rx signal at -70 dBm 8 MHz | | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ | | 17 | 18 | 21 | 28 | #### 4.4.4 Low Power Current Consumption **Table 10: Low power current consumption** | Power mode | Current consumption T A =25 o C, V VDD = V DDIO =3.3 V, V DD\_EPA =5.0 V V DD + V DD\_TX | Current consumption T A =25 o C, V VDD = V DDIO =3.3 V, V DD\_EPA =5.0 V V DD\_EPA | Current consumption T A =25 o C, V VDD = V DDIO =3.3 V, V DD\_EPA =5.0 V V DDIO | Current consumption T A =25 o C, V VDD = V DDIO =3.3 V, V DD\_EPA =5.0 V Unit | | ---------- | ---------------------------------------------------------------------------------------- | ---------------------------------------------------------------------------------- | ------------------------------------------------------------------------------- | ----------------------------------------------------------------------------- | | Hibernate | <1 | 1 | <1 | μA | | Deep Sleep | <2 | 1 | <1 | μA | | Sleep 1 | <20 | 1 | <1 | μA | | USB Sleep | <500 | 1 | <1 | μA | #### 4.4.5 Standby Current Consumption (using SDIO/SPI Host Interface) **Table 11: Standby current consumption** | Mode | T A =25 o C, V DD = V DDIO =3.3 V, V DD\_EPA =5.0 V, BW=2 MHz, RTC=RTC\_XTAL Sleep mode | T A =25 o C, V DD = V DDIO =3.3 V, V DD\_EPA =5.0 V, BW=2 MHz, RTC=RTC\_XTAL Beacon | V DD + V DD\_TX | V DD\_EPA | V DDIO | Unit | | ------ | --------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------- | --------------- | --------- | ------ | ---- | | DTIM3 | 1 | Long | 200 | <1 | 2 | μA | | DTIM10 | 1 | Long | 80 | <1 | 2 | μA | | DTIM40 | 1 | Long | 40 | <1 | 1 | μA | | DTIM3 | 1 | Short | 150 | <1 | 2 | μA | | DTIM10 | 1 | Short | 65 | <1 | 2 | μA | | DTIM40 | 1 | Short | 35 | <1 | 1 | μA | The DTIM (Delivery Traffic Indication Message) number (DTIMx) indicates how often a Wi-Fi HaLow station in power-saving Sleep mode should wake to receive traffic from the access point. It is expressed as a multiple of beacon intervals (102.4 ms). For example, DTIM1 indicates that the station should wake up every 102.4 ms, while DTIM40 configures the station to wake up every 4.1 seconds. Configuring DTIM is a complex compromise between power consumption and latency. Increasing the DTIM will reduce the average power consumption, as the station spends a greater proportion of time in Sleep mode, which consumes significantly less power than in Listen mode. However, since the station cannot receive traffic in Sleep mode, increasing DTIM also increases latency. DTIM settings should be optimized for the use case. ### 4.5 RF Specifications #### 4.5.1 Frequency Range The module operates in the 902 to 928 MHz frequency range. #### 4.5.2 Receiver Sensitivities for 10% packet error rate, 1000-byte packets. Conditions are VDD=3.3 V, VDD\_TX=3.3 V, VDD\_EPA=5.0 V, Ambient Temperature=25oC **Table 12: Rate vs receiver sensitivity** | MCS index | Modulation scheme | Coding rate | PHY rate (Mbps) per BW 1 MHz | PHY rate (Mbps) per BW 2 MHz | PHY rate (Mbps) per BW 4 MHz | PHY rate (Mbps) per BW 8 MHz | Typical receive sensitivity (dBm) per BW 1 MHz | Typical receive sensitivity (dBm) per BW 2 MHz | Typical receive sensitivity (dBm) per BW 4 MHz | Typical receive sensitivity (dBm) per BW 8 MHz | | --------- | ----------------- | ----------- | ---------------------------- | ---------------------------- | ---------------------------- | ---------------------------- | ---------------------------------------------- | ---------------------------------------------- | ---------------------------------------------- | ---------------------------------------------- | | 10 | BPSK | 1/2 x 2 | 0.1 | N/A | N/A | N/A | -107 | N/A | N/A | N/A | | 0 | BPSK | 1/2 | 0.3 | 0.7 | 1.5 | 3.3 | -106 | -102 | -101 | -97 | | 1 | QPSK | 1/2 | 0.7 | 1.4 | 3.0 | 6.5 | -104 | -100 | -99 | -95 | | 2 | QPSK | 3/4 | 1.0 | 2.2 | 4.5 | 9.8 | -101 | -98 | -96 | -92 | | 3 | 16-QAM | 1/2 | 1.3 | 2.9 | 6.0 | 13 | -98 | -95 | -93 | -89 | | 4 | 16-QAM | 3/4 | 2.0 | 4.3 | 9.0 | 20 | -95 | -92 | -90 | -86 | | 5 | 64-QAM | 2/3 | 2.7 | 5.8 | 12 | 26 | -91 | -88 | -85 | -82 | | 6 | 64-QAM | 3/4 | 3.0 | 6.5 | 14 | 29 | -89 | -86 | -84 | -80 | | 7 | 64-QAM | 5/6 | 3.3 | 7.2 | 15 | 33 | -88 | -85 | -83 | -79 | | 8 | 256-QAM | 3/4 | 4.0 | 8.9 | 18 | 39 | -83 | -81 | -78 | -75 | | 9 | 256-QAM | 5/6 | 4.4 | N/A | 20 | 43 | -82 | N/A | -77 | -73 | #### 4.5.3 Transmitter Note: The following transmit power levels are for IEEE compliance for 802.11ah. They do not consider any backoffs needed for regional spectrum compliance (e.g., FCC, IC). The restricted band-edge in regulatory regions will limit TX power in edge channels. **Table 13: Mean TX output power** | MCS index | Power output (dBm) at the module ANT pin per BW T A =25 o C, V DD = V DDIO =3.3 V, V DD\_EPA =5.0 V, IEEE-compliant with 1.5 dB SEM margin 1 MHz | Power output (dBm) at the module ANT pin per BW T A =25 o C, V DD = V DDIO =3.3 V, V DD\_EPA =5.0 V, IEEE-compliant with 1.5 dB SEM margin 2 MHz | Power output (dBm) at the module ANT pin per BW T A =25 o C, V DD = V DDIO =3.3 V, V DD\_EPA =5.0 V, IEEE-compliant with 1.5 dB SEM margin 4 MHz | Power output (dBm) at the module ANT pin per BW T A =25 o C, V DD = V DDIO =3.3 V, V DD\_EPA =5.0 V, IEEE-compliant with 1.5 dB SEM margin 8 MHz | | --------- | ------------------------------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------------------------------ | | 10 | 29.5 | N/A | N/A | N/A | | 0 | 29.0 | 28.5 | 28.5 | 28.0 | | 1 | 29.0 | 28.5 | 28.5 | 28.0 | | 2 | 29.0 | 28.5 | 28.0 | 28.0 | | 3 | 28.0 | 28.0 | 28.0 | 28.0 | | 4 | 27.5 | 27.5 | 27.5 | 27.5 | | 5 | 25.0 | 26.0 | 26.5 | 27.0 | | 6 | 24.5 | 25.5 | 26.0 | 26.0 | | 7 | 24.5 | 24.5 | 25.0 | 25.0 | | 8 | 23.0 | 23.5 | 24.0 | 24.0 | | 9 | 22.5 | N/A | 23.5 | 23.5 | ### 4.6 Digital IO Voltage Specifications **Table 14: Digital IO voltage specifications** | Parameters | Description | VDDIO | Min | Max | Unit | | ----------- | --------------------------------------------------------------------- | ----- | --- | ---- | ---- | | V IL\_VDDIO | Low input threshold for all GPIO and SDIO pins | 3.3 | - | 1.2 | V | | V IH\_VDDIO | High input threshold for all GPIO and SDIO pins | 3.3 | 1.7 | - | V | | V OL\_VDDIO | Low output voltage for all GPIO and SDIO pins, assuming an 8 mA load | 3.3 | - | 0.25 | V | | V OH\_VDDIO | High output voltage for all GPIO and SDIO pins, assuming an 8 mA load | 3.3 | 2.9 | - | V | ## 5 Module Dimensions ![Figure 10: Module dimensions](/files/572700789acf6b673eba772e54bc6490ac1c1606) *Figure 10: Module dimensions* ## 6 Recommended PCB Footprint ![Figure 11: PCB footprint](/files/45fc580a572140e6bf86ab2849e98cec65c49024) *Figure 11: PCB footprint* ## 7 Certification ### 7.1 FCC for MM8108-M20 The MM8108-M20 has been tested and found to comply with the Class B digital device limits pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio-frequency energy, and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: * Reorient or relocate the receiving antenna * Increase the separation between the equipment and receiver * Connect the equipment into an outlet on a circuit different from that to which the receiver is connected * Consult the dealer or an experienced radio/TV technician for help FCC caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. #### 7.1.1 FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance 20 cm between the radiator and your body. #### 7.1.2 Important Note To Integrators This module has been tested and found to comply with the following requirements for Modular Approval: * Part 15.247 - Operation within the bands 902-928 MHz #### 7.1.3 End Product User Manual Requirement In the end product, the antenna(s) used with this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operated in conjunction with any other antenna or transmitter except in accordance with multi-transmitter product procedures. Users and installers must be provided with antenna installation instructions and transmitter operating conditions to satisfy the RF exposure compliance. #### 7.1.4 Antennas This radio transmitter has been approved by the FCC and ISED to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. #### 7.1.5 Antennes Cet émetteur radio a été approuvé par la FCC et ISED pour fonctionner avec les types d'antennes répertoriés ci-dessous avec le gain maximal autorisé indiqué. Les types d'antennes non inclus dans cette liste, ayant un gain supérieur au gain maximum indiqué pour ce type, sont strictement interdits pour une utilisation avec cet appareil. **Table 15: Listen receive current consumption** | Radio | Antenna Type | Frequency (MHz) | Antenna Gain (dBi) | | -------- | -------------- | --------------- | ------------------ | | 802.11ah | Dipole Antenna | 902-928 | 1 | #### 7.1.6 End Product Label Requirement The end product must be labeled in a visible area with the following: **Figure 12: End product label requirement** | Contains FCC ID: 2A74O-ED502A | | ----------------------------- | #### 7.1.7 Test Modes This device uses various test-mode programs for setup, which operate separately from production firmware. Host integrators should contact the grantee for assistance with the test modes required for module/host compliance testing. #### 7.1.8 Additional Testing, Part 15 Subpart B Disclaimer The modular transmitter is only FCC authorized for the specific rule parts (i.e. FCC transmitter rules) listed on the grant, and the host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. #### 7.1.9 EMI Considerations Note that a host manufacturer is recommended to use the KDB996369 D04 Module Integration Guide, which recommends "best practice" RF design engineering testing and evaluation in case non-linear interactions generate additional non-compliant limits due to module placement relative to host components or properties. For standalone mode, reference the guidance in KDB996369 D04 Module Integration Guide, and for simultaneous mode, see KDB996369 D02 Module Q\&A Question 12, which permits the host manufacturer to confirm compliance. #### 7.1.10 Making Changes Only Grantees may make permissive changes. If the module will be used differently from the granted conditions, please contact us to ensure modifications will not affect compliance. #### 7.1.11 Antenna Trace Design The modular transmitter is configured for monostatic operation, requiring only a single RF I/O pin for full-duplex communication. The output must be routed to the antenna via 50 Ω microstrip or stripline on the OEM PCB. No coupling capacitor is required, given that the RF pin is AC-coupled internally. ### 7.2. IC for MM8108-M20 This device contains license-exempt transmitter(s) / receiver(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux. Deux conditions suivantes: (1) L'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. Caution: Exposure to Radio Frequency Radiation 1. To comply with the Canadian RF exposure compliance requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter 2. To comply with RSS 102 RF exposure compliance requirements, a separation distance of at least 20 cm must be maintained between the antenna of this device and all persons Attention: exposition au rayonnement radiofréquence: 1. Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas être co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur. 2. Pour se conformer aux exigences de conformité CNR 102 RF exposition, une distance de séparation d'au moins 20 cm doit être maintenue entre l'antenne de cet appareil et toutes les personnes #### 7.2.1 Antennas This radio transmitter has been approved by the ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. #### 7.2.2 Antennes Cet émetteur radio a été approuvé par la ISED pour fonctionner avec les types d'antennes répertoriés ci-dessous avec le gain maximal autorisé indiqué. Les types d'antennes non inclus dans cette liste, ayant un gain supérieur au gain maximum indiqué pour ce type, sont strictement interdits pour une utilisation avec cet appareil. **Table 16: Listen receive current consumption** | Radio | Antenna Type | Frequency (MHz) | Antenna Gain (dBi) | | -------- | -------------- | --------------- | ------------------ | | 802.11ah | Dipole Antenna | 902-928 | 1 | #### 7.2.3 Required End Product Labeling Any device incorporating this module must include an external, visible, permanent marking or label which states: **Figure 13: End product label requirement** | Contains IC: 29791-ED502A | | ------------------------- | #### 7.2.4 Obligation D'étiquetage Du Produit Final Tout dispositif intégrant ce module doit comporter un externe, visible, marquage permanent ou une étiquette qui dit: **Figure 14: End product label requirement** | Contient IC: 29791-ED502A | | ------------------------- | #### 7.2.5 RF Exposure Considerations In the end product, the antenna(s) used with this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operated in conjunction with any other antenna or transmitter except in accordance with multi-transmitter product procedures. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying the RF exposure compliance. ## 8 Part Numbers and Ordering Information **Table 17: Part number and ordering information** | Part Number | Packing Type | MOQ and Order Multiples | Part Size (mm) | Description | | ------------- | ------------ | ----------------------- | --------------- | ----------------------------------------------------------------------------------------- | | MM8108-M20-US | Tray | 100 | 18.5 x 14 x 3.0 | High Power Wi-Fi HaLow / IEEE 802.11ah Sub-1 GHz 1/2/4/8 MHz Module for the US and Canada | ## 9 Handling and Storage The modules are moisture-sensitive devices rated at Moisture Sensitive Level 3 (MSL3) per IPC/JEDEC J-STD-20. After opening the moisture-sealed storage bag, modules that will be subjected to reflow solder or other high-temperature processes must be: 1. Mounted to a circuit board within 168 hours at factory conditions (≤30°C and <60% RH), OR 2. Continuously stored per IPC/JEDEC J-STD-033 Modules exposed to moisture and environmental conditions exceeding packaging and storage conditions MUST be baked before mounting, according to IPC/JEDEC J-STD-033. Failure to meet packaging and storage conditions will result in irreparable damage to modules during the solder reflow process. ## 10 Revision History | Release Number | Release Date | Release Notes | | -------------- | ------------ | --------------------- | | Version 2 | 10 Apr 2026 | Updated Module Height | | Version 1 | 27 Mar 2026 | Preliminary Release | Morse Micro provides this information "as is" without warranties of any kind, express or implied. No guarantee is made as to the accuracy, completeness, or suitability of this information or Morse Micro’s products for any specific purpose. Use of this information and products is at the user’s sole risk. Morse Micro products are not designed or tested for use in mission-critical systems, and should not be used in such applications. Performance specifications are based on internal testing and are believed to be reliable; however, they are not guaranteed. It is the Buyer’s responsibility to test and validate all product performance, compatibility, and compliance, both in isolation and within end applications. Morse Micro assumes no liability for the use or application of any product, circuit, or information described herein. No license or other rights—express or implied—are granted under Morse Micro’s intellectual property. This document contains proprietary information of Morse Micro and is subject to change without notice. Wi-Fi®, Wi-Fi HaLow™, and the Wi-Fi logo are trademarks of Wi-Fi Alliance. ZigBee™ and Z-Wave™ are trademarks of their respective owners. All other trademarks are the property of their respective owners.