MM8108-M20 Preliminary Data Sheet
v2
1 Product Overview
1.1 Introduction
Wi-Fi HaLow (pronounced “HEY-low”) is the first global Wi-Fi standard (IEEE 802.11ah) specifically designed for the Internet of Things (IoT). It’s an open-standard wireless network technology operating in the sub-1 GHz license-exempt RF bands (850-950 MHz range), so it doesn’t incur ongoing monthly costs like cellular/mobile network connections. By operating in the sub-1 GHz range, this low-power wireless protocol can connect more IoT devices over much longer distances and with significantly lower power than traditional Wi-Fi.
Morse Micro, the world’s leading Wi-Fi HaLow solutions provider, offers several Wi-Fi HaLow connectivity solutions.
The MM8108-M20 is a fully integrated, high-power Wi-Fi HaLow module with long-range and excellent RF performance, featuring our second-generation MM8108 Wi-Fi HaLow SoCs.
The MM8108-M20-US module combines our world-leading MM8108 with a powerful external power amplifier (PA) that provides transmit amplification up to 28.5 dBm and a surface acoustic wave (SAW) filter that offers exceptional receive sensitivity tuned to the 902-928 MHz band. These innovations, combined with digital transmit filtering and pre-distortion circuits, result in an advanced transceiver design that ensures maximum performance and out-of-the-box compatibility with most global Wi-Fi HaLow regulatory environments.
MM8108-M20 supports a USB 2.0 High-Speed host interface and an SDIO/SPI host interface, offering solution architects flexibility when integrating Wi-Fi HaLow connectivity into their existing solution.
With a footprint of only 18.5 mm x 14 mm, the MM8108-M20 module has been designed to maximize the performance of our second-generation SoCs.
MM8108-M20 supports WPA3 and all standard security features required for Wi-Fi HaLow product certifications.
1.2 Features
Single-stream maximum PHY rate of 43.3 Mbps at 8 MHz bandwidth
Radio supporting worldwide Sub-1 GHz frequency bands
Frequency range: 902-928 MHz
Channel bandwidth options of 1/2/4/8 MHz
High power PA with a maximum 28.5 dBm (700 mW) output power
Low-power receiver with integrated LNA, NF < 4 dB
802.11ah OFDM PHY with Wi-Fi Alliance Wi-Fi HaLow certification
BPSK & QPSK, 16-QAM, 64-QAM and 256-QAM Modulation
Automatic frequency and gain control
Packet detection and channel equalization
Forward Error Correction (FEC) coding and decoding
Modulation and Coding Scheme (MCS) levels 0-10
1 MHz duplicate mode
Optional traveling pilots
802.11ah MAC with Wi-Fi Alliance Wi-Fi HaLow certification
Support for Station (STA) and Access Point (AP) roles
Listen-Before-Talk (LBT) access with energy detection
802.11 power save
802.11 fragmentation and defragmentation
Power-Saving Target Wake Time (TWT) support for extended battery life
Automatic and manual MCS rate selection
On-chip software stack assisting with host offload of Wi-Fi connection management
USB 2.0 High-Speed compliant device interface
Integrated USB 2.0 PHY and device interface supporting High-Speed mode at 480 Mbps
SDIO 2.0 compliant device interface
SDIO 2.0 High-Speed at 50 MHz max for 200 Mbps
Support for 1-bit and 4-bit data mode
Support for SPI mode operation at up to 80 MHz for 80 Mbps
Power Management Unit (PMU) supporting various modes of operation
A single 3.0-3.6 V supply for integrated DC-DCs and LDOs
A dedicated 5.0 V supply for the PA
Multiple low-power modes to reduce average power consumption
Broad spectrum of security features
Wi-Fi layer security, including Wi-Fi Protected Access version 3 (WPA3), Protected Management Frames (PMF), and Opportunistic Wireless Encryption (OWE)
Hardware support for Advanced Encryption Standard (AES) and Secure Hash Algorithm version 2 (SHA-2) functions (SHA-256, SHA-384, SHA-512)
1.3 Applications
Ideally suited for Internet of Things (IoT) and Machine-to-Machine (M2M) applications such as:
Surveillance cameras and sensors
Cloud connectivity
Low-power sensor networks
Building automation systems
Asset tracking and management
Machine performance monitors and sensors
Building access control and security
Drone video and navigation communications
Connected toys and games
Rural internet access
Agricultural networks
Utility smart meter and intelligent grid
Proximity sensors
Industrial automation controls
Smart home automation
EV car chargers
Appliances
Construction site connectivity
Smart signs and kiosks
Retail point-of-sale terminals
Vehicle-to-vehicle communications
IP sensor networks
Biometric IDs and keypads
Warehouse connectivity
Intelligent lighting controls
BT/ZigBee™/Z-Wave™ to Wi-Fi HaLow gateways
Wi-Fi to Wi-Fi HaLow bridges
Wi-Fi HaLow client adapters/dongles
Smart city networks
2 Pin Descriptions
The MM8108-M20 modules feature 51 pins, which are described in this section. The following illustration shows the top view of the module pins.
2.1 Default Pin Layout
Figure 1: Default pin layout diagram
2.2 Pin Descriptions
Table 1: Pin description
1
GND
Ground
Ground
2
GND
Ground
Ground
3
GPIO1
Digital I/O
Programmable digital I/O
4
GPIO0
Digital I/O
Programmable digital I/O
5
GPIO6
Digital I/O
Programmable digital I/O
6
GPIO7
Digital I/O
Programmable digital I/O
7
GPIO8
Digital I/O
Programmable digital I/O
8
GPIO9
Digital I/O
Programmable digital I/O
9
RESET_N [2]
Analog
Asynchronous chip reset (active low)
10
WAKE [2]
Analog
External wake from Deep Sleep and Snooze
11
JTAG_TMS
Digital I/O
JTAG Mode Select
12
JTAG_TCK
Digital I/O
JTAG Clock
13
JTAG_TDO
Digital I/O
JTAG Data Out
14
GND
Ground
Ground
15
JTAG_TDI
Digital I/O
JTAG Data In
16
VDD
Supply
3.3V VDD Supply
17
SDIO_D0 [1]
Digital I/O
SDIO Data line
SPI_MISO
18
SDIO_D1 [1]
Digital I/O
SDIO Data line
SPI_INT
19
SDIO_D3 [1]
Digital I/O
SDIO Data line
SPI_CS
20
SDIO_D2 [1][3]
Digital I/O
SDIO Data line
21
SDIO_CMD [1]
Digital I/O
SDIO Command line
SPI_MOSI
22
SDIO_CLK
Digital I/O
SDIO Clock input
SPI_SCK
23
GPIO5
Digital I/O
Programmable digital I/O
24
GND
Ground
Ground
25
GND
Ground
Ground
26
GPIO4
Digital I/O
Programmable digital I/O
27
GPIO3
Digital I/O
Programmable digital I/O
28
VDDIO
Supply
Host supply for digital I/O
29
GND
Ground
Ground
30
VDD_TX
Supply
3.3 V VDD-TX Supply
31
VDD_USB
Supply
USB Supply
32
GND
Ground
Ground
33
USB_DN
I/O
USB DN line
34
USB_DP
I/O
USB DP line
35
GND
Ground
Ground
36
VDD_EPA
Supply
5.0 V VDD-EPA Supply
37
VDD_EPA
Supply
5.0 V VDD-EPA Supply
38
GND
Ground
Ground
39
GND
Ground
Ground
40
GND
Ground
Ground
41
GND
Ground
Ground
42
GND
Ground
Ground
43
GND
Ground
Ground
44
GPIO2
Digital I/O
Programmable digital I/O
45
GND
Ground
Ground
46
GND
Ground
Ground
47
ANT
Analog
Antenna
48
GND
Ground
Thermal Ground
49
GND
Ground
Thermal Ground
50
GND
Ground
Thermal Ground
51
GND
Ground
Thermal Ground
[1] All SDIO bus pins, except SDIO_CLK, should be pulled up with a 10 kΩ to 100 kΩ resistor, as per the SDIO standard.
[2] Supplied from the VDD domain. The VDDIO domain drives other digital pins.
[3] Pull up SDIO_D2 when in SPI or SDIO mode
3 Functional Description
The following sections describe the module's functions.
3.1 Block Diagram
Figure 2: Functional block diagram
3.2 Power Supply Requirements
Module power is derived from a 3.0 to 3.6 V supply on pins VDD and VDD_TX, and a 5.0 V supply on pins VDD_EPA. VDD_EPA should be supplied from a clean, filtered, and regulated power supply that is not shared with other components.
VDDIO sets the module's IO voltage. It has an input voltage range of 2.25 V to 3.6 V and should be connected to the same power supply as the host MCU. There are no strict requirements for power-up sequencing.
3.3 USB Host Interface
A schematic diagram detailing the USB host interface circuit is shown below:
Figure 3: USB host interface circuit
3.4 SDIO Host Interface
When selecting a host to interface with the module via the SDIO interface, ensure the host supports SDIO 2.0 and supports SDIO clock speeds up to 50 MHz. Slower clock speeds will impact the maximum achievable throughput.
The SDIO data and command lines should be pulled up with resistors ranging from 10 kΩ to 100 kΩ, per the SDIO 2.0 specification.
For proper operation and to take advantage of the module’s power-saving features, connect RESET_N and WAKE to standard digital outputs (CMOS logic levels). The BUSY signal should be connected to a digital input (also CMOS logic levels). Do not use open-collector or open-drain circuits, as they will cause incorrect behavior.
In applications where the module must always be on, and power-saving features cannot be used, such as access points, the WAKE pin can be left unconnected, reducing the need for GPIOs on the host processor to only one.
A schematic diagram detailing the SDIO host interface circuit using the module’s power-saving features is shown below:
Figure 4: SDIO host interface circuit using power-saving features
A schematic diagram detailing the SDIO host interface circuit for always-on applications is shown below:
Figure 5: SDIO host interface circuit for always-on applications
3.5 SPI Host Interface
When selecting a host to interface with the module via the SPI interface, consider the following recommendations to achieve the best throughput:
The host must support level-triggered interrupts.
The host must support full-duplex SPI mode.
The host must support DMA-backed transactions on the SPI bus.
Standard SPI can achieve up to 25 Mbps at 50 MHz, but without DMA support, this will be significantly reduced. For example, an SPI interface with an 8-byte buffer per transaction might achieve only 2 Mbps on the SPI bus.
For proper operation and to take advantage of the module’s power-saving features, connect RESET and WAKE to standard digital outputs (CMOS logic levels). The BUSY signal should be connected to a digital input (also CMOS logic levels). Do not use open-collector or open-drain circuits, as they will cause incorrect behavior.
In applications where the module must always be on and power-saving features cannot be used, such as access points, the WAKE pin can be left unconnected, reducing the need for GPIOs on the host processor to only one.
A schematic diagram detailing the SPI host interface circuit using the module’s power-saving features is shown below:
Figure 6: SPI host interface circuit using power-saving features
A schematic diagram detailing the SPI host interface circuit for always-on applications is shown below:
Figure 7: SPI host interface circuit for always-on applications
3.6 Boot/Reset Sequencing
3.6.1 Boot Timing
Figure 8: Powering on and reset timing diagram
Table 2: Boot timing overview
V IL_nRST
Reset threshold
450
mV
t 0
Time between VDD brought up (3.3V) and RESET_N being activated
50
μs
t B
Boot Time
10
ms
3.6.2 Reset Timing
Figure 9: Powering on and reset timing diagram
Table 3: Reset timing overview
V IL_nRST
Reset threshold
450
mV
t 1
Duration of RESET_N signal level < VIL_nRST to reset the chip
1000
μs
t B
Boot Time
10
ms
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Stress beyond absolute maximum ratings may cause permanent damage to the module. Operation is guaranteed only within the recommended operating conditions. Operation of the device outside the recommended conditions may result in reduced lifetime and reliability issues, even if the absolute maximum ratings are not exceeded.
Table 4: Absolute maximum and minimum voltage ratings
VDD voltage
-0.3
3.6
V
VDD_TX voltage
-0.3
3.6
V
VDD_EPA voltage
-0.3
5.25
V
RESET_N/WAKE
-0.3
3.6
V
VDDIO
-0.3
3.6
V
Analog/RF pin
-0.3
1.2
V
Storage temperature
-40
125
°C
RF input power (CW)
-
6
dBm
4.2 ESD Immunity
Table 5: ESD immunity specifications
Electrostatic discharge (ESD) performance
Human body model (HBM), per ANSI / ESDA / JEDEC JS001
RF Input
-1,000
1,000
V
Electrostatic discharge (ESD) performance
Human body model (HBM), per ANSI / ESDA / JEDEC JS001
All pins except RF Input
-2000
2000
V
Electrostatic discharge (ESD) performance
Charged device model (CDM), per JESD22-C101
All pins
-500
500
V
4.3 Recommended Operating Conditions
Table 6: Recommended operating conditions
Ambient temperature
-40
85
°C
Storage temperature
-40
125
°C
VDD
3.0
3.3
3.6
V
VDD_TX
3.0
3.3
3.6
V
VDD_EPA
4.85
5.0
5.25
V
VDDI O
2.25
3.3
3.6
V
4.4 Power Consumption
4.4.1 Active Transmit Current Consumption
Table 7: Transmit current consumption for VDD, VDD_TX, and VDD_EPA
0
28
30
35
45
9
8
8
8
500
465
450
445
7
26
29
34
43
9
8
8
8
280
285
295
295
9
26
N/A
34
43
9
N/A
8
8
240
N/A
260
260
4.4.2 Active Receive Current Consumption
Table 8: Active receive current consumption
0
18
19
23
31
Max
18 (MCS9)
20 (MCS8)
24 (MCS9)
34 (MCS9)
4.4.3 Listen Receive Current Consumption
Table 9: Listen receive current consumption
17
18
21
28
4.4.4 Low Power Current Consumption
Table 10: Low power current consumption
Hibernate
<1
1
<1
μA
Deep Sleep
<2
1
<1
μA
Sleep 1
<20
1
<1
μA
USB Sleep
<500
1
<1
μA
4.4.5 Standby Current Consumption (using SDIO/SPI Host Interface)
Table 11: Standby current consumption
DTIM3
1
Long
200
<1
2
μA
DTIM10
1
Long
80
<1
2
μA
DTIM40
1
Long
40
<1
1
μA
DTIM3
1
Short
150
<1
2
μA
DTIM10
1
Short
65
<1
2
μA
DTIM40
1
Short
35
<1
1
μA
The DTIM (Delivery Traffic Indication Message) number (DTIMx) indicates how often a Wi-Fi HaLow station in power-saving Sleep mode should wake to receive traffic from the access point. It is expressed as a multiple of beacon intervals (102.4 ms).
For example, DTIM1 indicates that the station should wake up every 102.4 ms, while DTIM40 configures the station to wake up every 4.1 seconds.
Configuring DTIM is a complex compromise between power consumption and latency. Increasing the DTIM will reduce the average power consumption, as the station spends a greater proportion of time in Sleep mode, which consumes significantly less power than in Listen mode. However, since the station cannot receive traffic in Sleep mode, increasing DTIM also increases latency.
DTIM settings should be optimized for the use case.
4.5 RF Specifications
4.5.1 Frequency Range
The module operates in the 902 to 928 MHz frequency range.
4.5.2 Receiver
Sensitivities for 10% packet error rate, 1000-byte packets.
Conditions are VDD=3.3 V, VDD_TX=3.3 V, VDD_EPA=5.0 V, Ambient Temperature=25oC
Table 12: Rate vs receiver sensitivity
10
BPSK
1/2 x 2
0.1
N/A
N/A
N/A
-107
N/A
N/A
N/A
0
BPSK
1/2
0.3
0.7
1.5
3.3
-106
-102
-101
-97
1
QPSK
1/2
0.7
1.4
3.0
6.5
-104
-100
-99
-95
2
QPSK
3/4
1.0
2.2
4.5
9.8
-101
-98
-96
-92
3
16-QAM
1/2
1.3
2.9
6.0
13
-98
-95
-93
-89
4
16-QAM
3/4
2.0
4.3
9.0
20
-95
-92
-90
-86
5
64-QAM
2/3
2.7
5.8
12
26
-91
-88
-85
-82
6
64-QAM
3/4
3.0
6.5
14
29
-89
-86
-84
-80
7
64-QAM
5/6
3.3
7.2
15
33
-88
-85
-83
-79
8
256-QAM
3/4
4.0
8.9
18
39
-83
-81
-78
-75
9
256-QAM
5/6
4.4
N/A
20
43
-82
N/A
-77
-73
4.5.3 Transmitter
Note: The following transmit power levels are for IEEE compliance for 802.11ah. They do not consider any backoffs needed for regional spectrum compliance (e.g., FCC, IC). The restricted band-edge in regulatory regions will limit TX power in edge channels.
Table 13: Mean TX output power
10
29.5
N/A
N/A
N/A
0
29.0
28.5
28.5
28.0
1
29.0
28.5
28.5
28.0
2
29.0
28.5
28.0
28.0
3
28.0
28.0
28.0
28.0
4
27.5
27.5
27.5
27.5
5
25.0
26.0
26.5
27.0
6
24.5
25.5
26.0
26.0
7
24.5
24.5
25.0
25.0
8
23.0
23.5
24.0
24.0
9
22.5
N/A
23.5
23.5
4.6 Digital IO Voltage Specifications
Table 14: Digital IO voltage specifications
V IL_VDDIO
Low input threshold for all GPIO and SDIO pins
3.3
-
1.2
V
V IH_VDDIO
High input threshold for all GPIO and SDIO pins
3.3
1.7
-
V
V OL_VDDIO
Low output voltage for all GPIO and SDIO pins, assuming an 8 mA load
3.3
-
0.25
V
V OH_VDDIO
High output voltage for all GPIO and SDIO pins, assuming an 8 mA load
3.3
2.9
-
V
5 Module Dimensions
Figure 10: Module dimensions
6 Recommended PCB Footprint
Figure 11: PCB footprint
7 Certification
7.1 FCC for MM8108-M20
The MM8108-M20 has been tested and found to comply with the Class B digital device limits pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio-frequency energy, and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna
Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
Consult the dealer or an experienced radio/TV technician for help
FCC caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
7.1.1 FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance 20 cm between the radiator and your body.
7.1.2 Important Note To Integrators
This module has been tested and found to comply with the following requirements for Modular Approval:
Part 15.247 - Operation within the bands 902-928 MHz
7.1.3 End Product User Manual Requirement
In the end product, the antenna(s) used with this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operated in conjunction with any other antenna or transmitter except in accordance with multi-transmitter product procedures. Users and installers must be provided with antenna installation instructions and transmitter operating conditions to satisfy the RF exposure compliance.
7.1.4 Antennas
This radio transmitter has been approved by the FCC and ISED to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
7.1.5 Antennes
Cet émetteur radio a été approuvé par la FCC et ISED pour fonctionner avec les types d'antennes répertoriés ci-dessous avec le gain maximal autorisé indiqué. Les types d'antennes non inclus dans cette liste, ayant un gain supérieur au gain maximum indiqué pour ce type, sont strictement interdits pour une utilisation avec cet appareil.
Table 15: Listen receive current consumption
802.11ah
Dipole Antenna
902-928
1
7.1.6 End Product Label Requirement
The end product must be labeled in a visible area with the following:
Figure 12: End product label requirement
Contains FCC ID: 2A74O-ED502A
7.1.7 Test Modes
This device uses various test-mode programs for setup, which operate separately from production firmware. Host integrators should contact the grantee for assistance with the test modes required for module/host compliance testing.
7.1.8 Additional Testing, Part 15 Subpart B Disclaimer
The modular transmitter is only FCC authorized for the specific rule parts (i.e. FCC transmitter rules) listed on the grant, and the host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.
The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
7.1.9 EMI Considerations
Note that a host manufacturer is recommended to use the KDB996369 D04 Module Integration Guide, which recommends "best practice" RF design engineering testing and evaluation in case non-linear interactions generate additional non-compliant limits due to module placement relative to host components or properties.
For standalone mode, reference the guidance in KDB996369 D04 Module Integration Guide, and for simultaneous mode, see KDB996369 D02 Module Q&A Question 12, which permits the host manufacturer to confirm compliance.
7.1.10 Making Changes
Only Grantees may make permissive changes. If the module will be used differently from the granted conditions, please contact us to ensure modifications will not affect compliance.
7.1.11 Antenna Trace Design
The modular transmitter is configured for monostatic operation, requiring only a single RF I/O pin for full-duplex communication. The output must be routed to the antenna via 50 Ω microstrip or stripline on the OEM PCB. No coupling capacitor is required, given that the RF pin is AC-coupled internally.
7.2. IC for MM8108-M20
This device contains license-exempt transmitter(s) / receiver(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s).
Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux.
Deux conditions suivantes: (1) L'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement.
Caution: Exposure to Radio Frequency Radiation
To comply with the Canadian RF exposure compliance requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter
To comply with RSS 102 RF exposure compliance requirements, a separation distance of at least 20 cm must be maintained between the antenna of this device and all persons
Attention: exposition au rayonnement radiofréquence:
Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas être co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur.
Pour se conformer aux exigences de conformité CNR 102 RF exposition, une distance de séparation d'au moins 20 cm doit être maintenue entre l'antenne de cet appareil et toutes les personnes
7.2.1 Antennas
This radio transmitter has been approved by the ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
7.2.2 Antennes
Cet émetteur radio a été approuvé par la ISED pour fonctionner avec les types d'antennes répertoriés ci-dessous avec le gain maximal autorisé indiqué. Les types d'antennes non inclus dans cette liste, ayant un gain supérieur au gain maximum indiqué pour ce type, sont strictement interdits pour une utilisation avec cet appareil.
Table 16: Listen receive current consumption
802.11ah
Dipole Antenna
902-928
1
7.2.3 Required End Product Labeling
Any device incorporating this module must include an external, visible, permanent marking or label which states:
Figure 13: End product label requirement
Contains IC: 29791-ED502A
7.2.4 Obligation D'étiquetage Du Produit Final
Tout dispositif intégrant ce module doit comporter un externe, visible, marquage permanent ou une étiquette qui dit:
Figure 14: End product label requirement
Contient IC: 29791-ED502A
7.2.5 RF Exposure Considerations
In the end product, the antenna(s) used with this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operated in conjunction with any other antenna or transmitter except in accordance with multi-transmitter product procedures. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying the RF exposure compliance.
8 Part Numbers and Ordering Information
Table 17: Part number and ordering information
MM8108-M20-US
Tray
100
18.5 x 14 x 3.0
High Power Wi-Fi HaLow / IEEE 802.11ah Sub-1 GHz 1/2/4/8 MHz Module for the US and Canada
9 Handling and Storage
The modules are moisture-sensitive devices rated at Moisture Sensitive Level 3 (MSL3) per IPC/JEDEC J-STD-20.
After opening the moisture-sealed storage bag, modules that will be subjected to reflow solder or other high-temperature processes must be:
Mounted to a circuit board within 168 hours at factory conditions (≤30°C and <60% RH),
OR
Continuously stored per IPC/JEDEC J-STD-033
Modules exposed to moisture and environmental conditions exceeding packaging and storage conditions MUST be baked before mounting, according to IPC/JEDEC J-STD-033.
Failure to meet packaging and storage conditions will result in irreparable damage to modules during the solder reflow process.
10 Revision History
Version 2
10 Apr 2026
Updated Module Height
Version 1
27 Mar 2026
Preliminary Release
Morse Micro provides this information "as is" without warranties of any kind, express or implied. No guarantee is made as to the accuracy, completeness, or suitability of this information or Morse Micro’s products for any specific purpose. Use of this information and products is at the user’s sole risk. Morse Micro products are not designed or tested for use in mission-critical systems, and should not be used in such applications. Performance specifications are based on internal testing and are believed to be reliable; however, they are not guaranteed. It is the Buyer’s responsibility to test and validate all product performance, compatibility, and compliance, both in isolation and within end applications. Morse Micro assumes no liability for the use or application of any product, circuit, or information described herein. No license or other rights—express or implied—are granted under Morse Micro’s intellectual property. This document contains proprietary information of Morse Micro and is subject to change without notice. Wi-Fi®, Wi-Fi HaLow™, and the Wi-Fi logo are trademarks of Wi-Fi Alliance. ZigBee™ and Z-Wave™ are trademarks of their respective owners. All other trademarks are the property of their respective owners.
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