> For the complete documentation index, see [llms.txt](https://docs.morsemicro.com/llms.txt). Markdown versions of documentation pages are available by appending `.md` to page URLs; this page is available as [Markdown](https://docs.morsemicro.com/datasheets/mm8108-mf15457-data-sheet.md). # MM8108-MF15457 Data Sheet [Download as PDF](https://www.morsemicro.com/resources/datasheets/modules/MM8108-MF15457_Data_Sheet.pdf) ## 1 Product Overview ### 1.1 Introduction Wi-Fi HaLow (pronounced “HEY-low”) is the first global Wi-Fi standard (IEEE 802.11ah) specifically designed to meet the needs of the Internet of Things (IoT). It’s an open standard wireless network technology operating in the sub-1 GHz license-exempt RF bands (850-950 MHz range), so it doesn’t incur ongoing monthly costs like cellular/mobile network connections. By operating in the sub-1 GHz range, this low-power wireless protocol can connect more IoT devices over much longer distances and with significantly lower power than traditional Wi-Fi. Morse Micro, the world’s leading Wi-Fi HaLow solutions provider, offers several Wi-Fi HaLow connectivity solutions. The MM8108-MF15457 is a fully integrated Wi-Fi HaLow module with long range, low power consumption, and excellent RF performance, featuring our second-generation MM8108 Wi-Fi HaLow SoC. It is compliant with IEEE 802.11ah, supporting PHY rates up to 43.3 Mbps, and provides for operation in the sub-1 GHz license-exempt RF bands. The radio in the MM8108 supports programmable operation in these bands worldwide, spanning from 850 MHz to 950 MHz. The MM8108’s integrated power amplifier (PA) offers world-leading transmit performance and energy efficiency with on-chip amplification of up to 26 dBm, which is ideal for low-cost devices. The ultra-high linearity integrated low-noise amplifier (LNA) offers exceptional receive sensitivity. These innovations, combined with digital transmit filtering and pre-distortion circuits, result in an advanced transceiver design that ensures out-of-the-box compatibility with all global Wi-Fi HaLow regulatory environments. MM8108-MF15457 supports a USB 2.0 High-Speed host interface and an SDIO/SPI host interface, offering solution architects flexibility when integrating Wi-Fi HaLow connectivity into their existing solution. With a footprint of only 11 mm x 10 mm, the MM8108-MF15457 module has been designed to showcase the cost and size benefits of the higher level of integration of our second-generation SoC. MM8108-MF15457 supports WPA3 and all standard security features required for Wi-Fi HaLow product certifications. ### 1.2 Features * Single-stream maximum PHY rate of 43.3 Mbps at 8 MHz bandwidth * Radio supporting worldwide Sub-1 GHz frequency bands * Frequency range: 850-950 MHz * Channel bandwidth options of 1/2/4/8 MHz * High power and extremely high efficiency integrated PA with maximum 26 dBm (400 mW) output power at 45% PA efficiency and 37% SoC efficiency * Novel PA architecture maintains efficiency at power backoff * Low-power receiver with integrated LNA, NF < 4 dB * 802.11ah OFDM PHY with Wi-Fi Alliance Wi-Fi HaLow certification * BPSK & QPSK, 16-QAM, 64-QAM and 256-QAM Modulation * Automatic frequency and gain control * Packet detection and channel equalization * Forward Error Correction (FEC) coding and decoding * Modulation and Coding Scheme (MCS) levels 0-10 * 1 MHz duplicate mode * Optional traveling pilots * 802.11ah MAC with Wi-Fi Alliance Wi-Fi HaLow certification * Support for Station (STA) and Access Point (AP) roles * Listen-Before-Talk (LBT) access with energy detection * 802.11 power save * 802.11 fragmentation and defragmentation * Power-Saving Target Wake Time (TWT) support for extended battery life * Automatic and manual MCS rate selection * On-chip software stack assisting with host offload of Wi-Fi connection management * USB 2.0 High-Speed compliant device interface * Integrated USB 2.0 PHY and device interface supporting High-Speed mode at 480 Mbps * SDIO 2.0 compliant device interface * SDIO 2.0 High-Speed at 50 MHz max for 200 Mbps * Support for 1-bit and 4-bit data mode * Support for SPI mode operation at up to 80 MHz for 80 Mbps * Power Management Unit (PMU) supporting various modes of operation * Single supply 3.0-3.6 V for integrated DC-DCs and LDOs * Multiple low-power modes (hibernate, deep sleep, snooze) support extreme power environments * Broad spectrum of security features * Wi-Fi layer security, including Wi-Fi Protected Access version 3 (WPA3), Protected Management Frames (PMF), and Opportunistic Wireless Encryption (OWE) * Hardware support for Advanced Encryption Standard (AES) and Secure Hash Algorithm version 2 (SHA-2) functions (SHA-256, SHA-384, SHA-512) ### 1.3 Applications Ideally suited for Internet of Things (IoT) and Machine-to-Machine (M2M) applications such as: * Surveillance cameras and sensors * Cloud connectivity * Low-power sensor networks * Building automation systems * Asset tracking and management * Machine performance monitors and sensors * Building access control and security * Drone video and navigation communications * Connected toys and games * Rural internet access * Agricultural networks * Utility smart meter and intelligent grid * Proximity sensors * Industrial automation controls * Smart home automation * EV car chargers * Appliances * Construction site connectivity * Smart signs and kiosks * Retail point-of-sale terminals * Vehicle-to-vehicle communications * IP sensor networks * Biometric IDs and keypads * Warehouse connectivity * Intelligent lighting controls * BT/ZigBee™/Z-Wave™ to Wi-Fi HaLow gateways * Wi-Fi to Wi-Fi HaLow bridges * Wi-Fi HaLow client adapters/dongles * Smart city networks ## 2 Pin Descriptions The MM8108-MF15457 module features 38 pins, which are described in this section. The following illustration shows the top view of the module pins. ![Figure 1: Pin diagram](/files/7f3bdf3351d2906b3302ee9d85e9a5896bf16755) *Figure 1: Pin diagram* | Pin | Pin Name | Type | Description | Alternative | | --- | -------------- | ----------- | ---------------------------------------- | ----------- | | 1 | GND | Ground | Ground | | | 2 | ANT | Analog | Antenna | | | 3 | GND | Ground | Ground | | | 4 | RESET\_N \[2] | Digital I/O | Asynchronous chip reset (active low) | | | 5 | WAKE \[2] | Digital I/O | External wake from Deep Sleep and Snooze | | | 6 | JTAG\_TMS | Digital I/O | JTAG Mode Select | GPIO15 \[3] | | 7 | JTAG\_TCK | Digital I/O | JTAG Clock | GPIO13 \[3] | | 8 | JTAG\_TDO | Digital I/O | JTAG Data Out | GPIO16 \[3] | | 9 | JTAG\_TDI | Digital I/O | JTAG Data In | GPIO14 \[3] | | 10 | VBAT | Supply | 3.3 V VBAT Supply | | | 11 | GND | Ground | Ground | | | 12 | SDIO\_D0 \[1] | Digital I/O | SDIO Data line | SPI\_MISO | | 13 | SDIO\_D3 \[1] | Digital I/O | SDIO Data line | SPI\_CS | | 14 | SDIO\_D1 \[1] | Digital I/O | SDIO Data line | SPI\_INT | | 15 | SDIO\_D2 \[1] | Digital I/O | SDIO Data line | | | 16 | SDIO\_CMD \[1] | Digital I/O | SDIO Command line | SPI\_MOSI | | 17 | SDIO\_CLK | Digital I/O | SDIO Clock input | SPI\_SCK | | 18 | GPIO5 \[3] | Digital I/O | Programmable digital I/O | | | 19 | GPIO4 \[3] | Digital I/O | Programmable digital I/O | | | 20 | GND | Ground | Ground | | | 21 | GPIO3 \[3] | Digital I/O | Programmable digital I/O | | | 22 | VDDIO | Supply | Host supply for digital I/O | | | 23 | GND | Ground | Ground | | | 24 | VBAT\_TX | Supply | 3.3 V VBAT-TX Supply | | | 25 | VDD\_USB | Supply | USB Supply | | | 26 | GND | Ground | Ground | | | 27 | USB\_D\_N | Digital I/O | USB DM line | | | 28 | USB\_D\_P | Digital I/O | USB DP line | | | 29 | BUSY | Digital I/O | BUSY signal output | | | 30 | GND | Ground | Ground | | | 31 | GPIO1 \[3] | Digital I/O | Programmable digital I/O | | | 32 | GPIO0 \[3] | Digital I/O | Programmable digital I/O | | | 33 | GPIO6 \[3] | Digital I/O | Programmable digital I/O | | | 34 | GPIO7 \[3] | Digital I/O | Programmable digital I/O | | | 35 | GPIO8 \[3] | Digital I/O | Programmable digital I/O | | | 36 | GPIO 9 \[3] | Digital I/O | Programmable digital I/O | | | 37 | GPIO10 \[3] | Digital I/O | Programmable digital I/O | | | 38 | GND | Ground | Ground | | \[1] All SDIO bus pins except SDIO\_CLK should be pulled up with a 10 kΩ to 100 kΩ resistor as per the SDIO standard. \[2] Supplied from VBAT domain. The VDDIO domain drives other digital pins. \[3] GPIOs 0 to 10 may provide alternative functions, including SPI master, I2C master, PWM, and UART. This functionality necessitates custom software, which Morse Micro can develop upon request. For further details, please contact Morse Micro. ## 3 Functional Description The following sections describe the functions of the MM8108-MF15457 module. ### 3.1 Block Diagram ![Figure 2: Functional block diagram](/files/7dcd66132277691ac7ecd9136c940c42ea4b43d8) *Figure 2: Functional block diagram* ### 3.2 Power Supply Requirements MM8108-MF15457 module power is derived from a 3.0 to 3.6 V supply on pins VBAT and VBAT\_TX. VDDIO sets the IO voltage of the MM8108-MF15457. It has an input voltage range of 2.25 V to 3.6 V and should be connected to the same power supply as the host MCU. There are no strict power-up sequencing requirements. ### 3.3 USB Host Interface A schematic diagram detailing the USB host interface circuit is shown below: ![Figure 3: USB host interface circuit](/files/82e59a134a104929d400978fd4e4d7ecf4f4d6dd) *Figure 3: USB host interface circuit* ### 3.4 USB Network Adapter Interface A schematic diagram detailing the USB network adapter circuit is shown below: ![Figure 4: USB network adapter circuit](/files/0be5d68d301a8dc63ae09505c2f58e361e51da1e) *Figure 4: USB network adapter circuit* ### 3.5 SDIO Host Interface When selecting a host to interface with the MM8108-MF15457 module via the SDIO interface, ensure the host supports SDIO 2.0 with SDIO clock speeds of up to 50 MHz. Slower clock speeds will impact the maximum achievable throughput. The SDIO data and command lines should be pulled up with 10 kΩ to 100 kΩ resistors per the SDIO 2.0 specification. For proper operation and to take advantage of the module’s power-saving features, connect RESET\_N and WAKE to standard digital outputs (CMOS logic levels). The BUSY signal should be connected to a digital input (also CMOS logic levels). Do not use open-collector or open-drain circuits, as they will cause incorrect behavior. In applications where the module must always be on, and the power-saving features can not be used, such as access points, the WAKE pin can be left not connected, reducing the need for GPIOs on the host processor to only one. A schematic diagram detailing the SDIO host interface circuit using the module’s power-saving features is shown below: ![Figure 5: SDIO host interface circuit using power-saving features](/files/a0706d0c664a79de734aecd80ff847a846262c15) *Figure 5: SDIO host interface circuit using power-saving features* A schematic diagram detailing the SDIO host interface circuit for always-on applications is shown below: ![Figure 6: SDIO host interface circuit for always-on applications](/files/ce8c1ef5291c2ed061b01818b18010698038bb7e) *Figure 6: SDIO host interface circuit for always-on applications* ### 3.6 SPI Host Interface When selecting a host to interface with the MM8108-MF15457 module via the SPI interface, consider the following recommendations to achieve the best throughput: * The host must support level-triggered interrupts. * The host must support full-duplex SPI mode. * The host must support DMA-backed transactions on the SPI bus. Standard SPI can achieve up to 25 Mbps at 50 MHz, which will be significantly reduced without DMA support. For example, an SPI interface with an 8-byte buffer per transaction might only achieve 2 Mbps throughput on the SPI bus. For proper operation and to take advantage of the module’s power-saving features, connect RESET and WAKE to standard digital outputs (CMOS logic levels). The BUSY signal should be connected to a digital input (also CMOS logic levels). Do not use open-collector or open-drain circuits, as they will cause incorrect behavior. In applications where the module must always be on, and the power-saving features can not be used, such as access points, the WAKE pin can be left not connected, reducing the need for GPIOs on the host processor to only one. A schematic diagram detailing the SPI host interface circuit using the module’s power-saving features is shown below: ![Figure 7: SPI host interface circuit using power-saving features](/files/7d133906ffb0aee7c6bf1d9eee4b075c243106ff) *Figure 7: SPI host interface circuit using power-saving features* A schematic diagram detailing the SPI host interface circuit for always-on applications is shown below: ![Figure 8: SPI host interface circuit for always-on applications](/files/9e0ca3f2a044124dcf8778a81e6a2ee411ab008b) *Figure 8: SPI host interface circuit for always-on applications* ### 3.7 Boot/Reset Sequencing #### 3.7.1 Boot Timing ![Figure 9: Powering on and reset timing diagram](/files/98277b1b35dcf7c1c9c70b3ca8e4a9a09b087071) *Figure 9: Powering on and reset timing diagram* **Table 1: Boot timing overview** | Parameters | Description | Min | Max | Unit | | ---------- | ---------------------------------------------------------------- | --- | --- | ---- | | V IL\_nRST | Reset threshold | 450 | | mV | | t 0 | Time between VBAT brought up (3.3V) and RESET\_N being activated | 50 | | μs | | t B | Boot Time | | 10 | ms | #### 3.7.2 Reset Timing ![Figure 10: Powering on and reset timing diagram](/files/8240ea1b47a39845a0d54e5a4285f1d213bf4985) *Figure 10: Powering on and reset timing diagram* **Table 2: Reset timing overview** | Parameters | Description | Min | Max | Unit | | ---------- | --------------------------------------------------------------- | ---- | --- | ---- | | V IL\_nRST | Reset threshold | 450 | | mV | | t 1 | Duration of RESET\_N signal level < VIL\_nRST to reset the chip | 1000 | | μs | | t B | Boot Time | | 10 | ms | ## 4 Electrical Characteristics ### 4.1 Absolute Maximum Ratings Stress beyond absolute maximum ratings may cause permanent damage to the MM8108-MF15457 module. Operation is only guaranteed within the recommended operation conditions. Operation of the device outside of the recommended conditions may result in a reduced lifetime and reliability problems, even if the absolute maximum ratings are not exceeded. **Table 3: Absolute maximum and minimum voltage ratings** | Parameter | Min | Max | Unit | | ------------------- | ---- | --- | ---- | | VBAT voltage | -0.3 | 3.6 | V | | VBAT\_TX voltage | -0.3 | 3.6 | V | | RESET\_N/WAKE | -0.3 | 3.6 | V | | VDDIO | -0.3 | 3.6 | V | | Analog/RF pin | -0.3 | 1.0 | V | | Storage temperature | -40 | 125 | °C | | RF input power (CW) | - | 6 | dBm | ### 4.2 ESD Immunity **Table 4: ESD immunity specifications** | Parameter | Parameter | Parameter | Min | Max | Unit | | ----------------------------------------- | ----------------------------------------------------- | ------------------------ | ------ | ----- | ---- | | Electrostatic discharge (ESD) performance | Human body model (HBM), per ANSI / ESDA / JEDEC JS001 | RF Input | -1,000 | 1,000 | V | | Electrostatic discharge (ESD) performance | Human body model (HBM), per ANSI / ESDA / JEDEC JS001 | All pins except RF Input | -2000 | 2000 | V | | Electrostatic discharge (ESD) performance | Charged device model (CDM), per JESD22-C101 | All pins | -500 | 500 | V | ### 4.3 Recommended Operating Conditions **Table 5: Recommended operating conditions** | Parameter | Min | Typ | Max | Unit | | ------------------- | ---- | --- | --- | ---- | | Ambient temperature | -40 | | 85 | °C | | Storage temperature | -40 | | 125 | °C | | VBAT | 3.0 | 3.3 | 3.6 | V | | VBAT\_TX | 3.0 | 3.3 | 3.6 | V | | VDDI O | 2.25 | 3.3 | 3.6 | V | ### 4.4 Power Consumption #### 4.4.1 Active Transmit Current Consumption **Table 6: Transmit current consumption for VBAT, VBAT\_TX separated** | MCS Index | Current consumption (mA) per BW at V BAT 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V 1 MHz | Current consumption (mA) per BW at V BAT 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V 2 MHz | Current consumption (mA) per BW at V BAT 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V 4 MHz | Current consumption (mA) per BW at V BAT 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V 8 MHz | Current consumption (mA) per BW at V BAT\_TX 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V 1 MHz | Current consumption (mA) per BW at V BAT\_TX 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V 2 MHz | Current consumption (mA) per BW at V BAT\_TX 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V 4 MHz | Current consumption (mA) per BW at V BAT\_TX 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V 8 MHz | | --------- | -------------------------------------------------------------------------------------------------- | -------------------------------------------------------------------------------------------------- | -------------------------------------------------------------------------------------------------- | -------------------------------------------------------------------------------------------------- | ------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------ | | 10 | 51 | N/A | N/A | N/A | 281 | N/A | N/A | N/A | | 0 | 52 | 51 | 50 | 59 | 279 | 243 | 160 | 132 | | 1 | 52 | 51 | 50 | 59 | 278 | 243 | 159 | 131 | | 2 | 51 | 51 | 50 | 59 | 277 | 243 | 158 | 130 | | 3 | 51 | 51 | 50 | 59 | 266 | 242 | 158 | 130 | | 4 | 49 | 50 | 50 | 59 | 221 | 221 | 152 | 130 | | 5 | 44 | 47 | 48 | 58 | 144 | 174 | 128 | 125 | | 6 | 42 | 44 | 46 | 57 | 118 | 119 | 109 | 106 | | 7 | 36 | 39 | 44 | 54 | 88 | 96 | 98 | 95 | | 8 | 34 | 38 | 43 | 52 | 69 | 78 | 83 | 81 | | 9 | 32 | N/A | 40 | 49 | 54 | N/A | 63 | 58 | #### 4.4.2 Active Receive Current Consumption **Table 7: Active receive current consumption** | MCS Index | V BAT + V BAT\_TX + V DDIO Current consumption (mA) per BW 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V, Rx signal at -70dBm 1 MHz | V BAT + V BAT\_TX + V DDIO Current consumption (mA) per BW 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V, Rx signal at -70dBm 2 MHz | V BAT + V BAT\_TX + V DDIO Current consumption (mA) per BW 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V, Rx signal at -70dBm 4 MHz | V BAT + V BAT\_TX + V DDIO Current consumption (mA) per BW 100% duty cycle, T A =25 o C, V BAT = V DDIO =3.3 V, Rx signal at -70dBm 8 MHz | | --------- | ----------------------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------------------- | | 0 | 20 | 21 | 24 | 32 | | Max | 20 (MCS9) | 21 (MCS8) | 26 (MCS9) | 34 (MCS9) | #### 4.4.3 Listen Receive Current Consumption **Table 8: Listen receive current consumption** | V BAT + V BAT\_TX + V DDIO Current consumption (mA) per BW T A =25 o C, V BAT = V DDIO =3.3 V, Rx signal at -70dBm 1 MHz | V BAT + V BAT\_TX + V DDIO Current consumption (mA) per BW T A =25 o C, V BAT = V DDIO =3.3 V, Rx signal at -70dBm 2 MHz | V BAT + V BAT\_TX + V DDIO Current consumption (mA) per BW T A =25 o C, V BAT = V DDIO =3.3 V, Rx signal at -70dBm 4 MHz | V BAT + V BAT\_TX + V DDIO Current consumption (mA) per BW T A =25 o C, V BAT = V DDIO =3.3 V, Rx signal at -70dBm 8 MHz | | ------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------ | ------------------------------------------------------------------------------------------------------------------------ | | 19 | 20 | 23 | 29 | #### 4.4.4 Low Power Current Consumption **Table 9: Low power current consumption** | Power Mode | Current Consumption T A =25 o C, V BAT = V DDIO =3.3 V V BAT + V BAT\_TX | Current Consumption T A =25 o C, V BAT = V DDIO =3.3 V V DDIO | Current Consumption T A =25 o C, V BAT = V DDIO =3.3 V Unit | | ---------- | ------------------------------------------------------------------------ | ------------------------------------------------------------- | ----------------------------------------------------------- | | Hibernate | <1 | <1 | μA | | Deep Sleep | <2 | <1 | μA | | Snooze | <20 | <1 | μA | | USB snooze | <500 | <1 | μA | #### 4.4.5 Standby Current Consumption (using SDIO/SPI Host Interface) **Table 10: Standby current consumption** | Mode | Condition: T A =25 o C, V BAT = V DDIO =3.3 V | V BAT + V BAT\_TX | V DDIO | Unit | | ------ | --------------------------------------------- | ----------------- | ------ | ---- | | DTIM3 | 2MHz channel, RTC=RTC\_XTAL, beacon=long | 176 | <1 | μA | | DTIM10 | 2MHz channel, RTC=RTC\_XTAL, beacon=long | 68 | <1 | μA | | DTIM40 | 2MHz channel, RTC=RTC\_XTAL, beacon=long | 33 | <1 | μA | | DTIM3 | 2MHz channel, RTC=RTC\_XTAL, beacon=short | 126 | <1 | μA | | DTIM10 | 2MHz channel, RTC=RTC\_XTAL, beacon=short | 52 | <1 | μA | | DTIM40 | 2MHz channel, RTC=RTC\_XTAL, beacon=short | 29 | <1 | μA | The DTIM (Delivery Traffic Indication Message) number (DTIMx) indicates how often a Wi-Fi HaLow station in power-saving Snooze mode should wake to receive traffic from the access point. It is expressed as a multiple of beacon intervals (multiples of 102.4 ms). For example, DTIM1 indicates that the station should wake up every 102.4 ms, while DTIM40 configures the station to wake up every 4.1 seconds. Configuring DTIM is a complex compromise between power consumption and latency. Increasing the DTIM will reduce the average power consumption, as the station spends a greater proportion of time in Snooze mode, which consumes significantly less power than in Listen mode. However, since the station is unable to receive traffic in Snooze mode, increasing DTIM also increases latency. DTIM settings should be optimized appropriately according to the use case. ### 4.5 RF Specifications #### 4.5.1 Frequency Range The MM8108-MF15457 radio operates in the frequency range from 850 MHz to 950 MHz. #### 4.5.2 Receiver Sensitivities for 10% packet error rate, 256-byte packets. Conditions are VBAT=3.3 V, VBAT\_TX=3.3 V, 25oC **Table 11: Rate vs receiver sensitivity** | MCS index | Modulation scheme | Coding rate | PHYrate (Mbps) per BW 1 MHz | PHYrate (Mbps) per BW 2 MHz | PHYrate (Mbps) per BW 4 MHz | PHYrate (Mbps) per BW 8 MHz | Minimum receive sensitivity (dBm) per BW 1 MHz | Minimum receive sensitivity (dBm) per BW 2 MHz | Minimum receive sensitivity (dBm) per BW 4 MHz | Minimum receive sensitivity (dBm) per BW 8 MHz | | --------- | ----------------- | ----------- | --------------------------- | --------------------------- | --------------------------- | --------------------------- | ---------------------------------------------- | ---------------------------------------------- | ---------------------------------------------- | ---------------------------------------------- | | 10 | BPSK | 1/2 x 2 | 0.1 | N/A | N/A | N/A | -107 | N/A | N/A | N/A | | 0 | BPSK | 1/2 | 0.3 | 0.7 | 1.5 | 3.3 | -106 | -103 | -102 | -98 | | 1 | QPSK | 1/2 | 0.7 | 1.4 | 3.0 | 6.5 | -104 | -101 | -99 | -95 | | 2 | QPSK | 3/4 | 1.0 | 2.2 | 4.5 | 9.8 | -102 | -99 | -97 | -93 | | 3 | 16-QAM | 1/2 | 1.3 | 2.9 | 6.0 | 13 | -99 | -96 | -94 | -90 | | 4 | 16-QAM | 3/4 | 2.0 | 4.3 | 9.0 | 20 | -96 | -93 | -90 | -87 | | 5 | 64-QAM | 2/3 | 2.7 | 5.8 | 12 | 26 | -92 | -89 | -86 | -83 | | 6 | 64-QAM | 3/4 | 3.0 | 6.5 | 14 | 29 | -90 | -87 | -85 | -81 | | 7 | 64-QAM | 5/6 | 3.3 | 7.2 | 15 | 33 | -89 | -86 | -83 | -80 | | 8 | 256-QAM | 3/4 | 4.0 | 8.9 | 18 | 39 | -85 | -82 | -79 | -76 | | 9 | 256-QAM | 5/6 | 4.4 | N/A | 20 | 43 | -83 | N/A | -78 | -74 | #### 4.5.3 Transmitter Note: The following transmit power levels are for IEEE compliance for 802.11ah. They do not consider any backoffs needed for regional spectrum compliance (e.g., FCC, IC, TELEC). TX power in edge channels will be limited by the restricted band edge in the regulatory regions. **Table 12: Mean TX output power** | MCS Index | Power output (dBm) at the module ANT pin per BW T A =25 o C, V BAT = V DDIO =3.3 V, IEEE-compliant with 1.5dB SEM margin 1MHz | Power output (dBm) at the module ANT pin per BW T A =25 o C, V BAT = V DDIO =3.3 V, IEEE-compliant with 1.5dB SEM margin 2MHz | Power output (dBm) at the module ANT pin per BW T A =25 o C, V BAT = V DDIO =3.3 V, IEEE-compliant with 1.5dB SEM margin 4MHz | Power output (dBm) at the module ANT pin per BW T A =25 o C, V BAT = V DDIO =3.3 V, IEEE-compliant with 1.5dB SEM margin 8MHz | | --------- | ----------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------- | ----------------------------------------------------------------------------------------------------------------------------- | | 10 | 25.5 | N/A | N/A | N/A | | 0 | 25.5 | 25.0 | 22.5 | 22.5 | | 1 | 25.5 | 25.0 | 22.5 | 22.0 | | 2 | 25.5 | 25.0 | 22.5 | 22.0 | | 3 | 25.0 | 25.0 | 22.5 | 22.0 | | 4 | 24.0 | 24.5 | 22.5 | 22.0 | | 5 | 21.5 | 23.0 | 21.5 | 21.5 | | 6 | 22.5 | 21.5 | 20.5 | 20.5 | | 7 | 19.0 | 20.0 | 19.5 | 20.0 | | 8 | 17.5 | 18.0 | 19.0 | 19.0 | | 9 | 15.5 | N/A | 17.0 | 16.0 | ### 4.6 Digital IO Voltage Specifications **Table 13: Digital IO voltage specifications** | Parameters | Description | VDDIO | Min | Max | Unit | | ----------- | -------------------------------------------------------------------- | ----- | --- | ---- | ---- | | V IL\_VDDIO | Low input threshold for all GPIO and SDIO pins | 3.3 | - | 1.2 | V | | V IH\_VDDIO | High input threshold for all GPIO and SDIO pins | 3.3 | 1.7 | - | V | | V OL\_VDDIO | Low output voltage for all GPIO and SDIO pins, assuming an 8mA load | 3.3 | - | 0.25 | V | | V OH\_VDDIO | High output voltage for all GPIO and SDIO pins, assuming an 8mA load | 3.3 | 2.9 | - | V | ## 5 Module Dimensions ![Figure 11: Module dimensions](/files/106b552a43c15e825f71de5c669f8f1eab237328) *Figure 11: Module dimensions* ## 6 Recommended PCB Footprint ![Figure 12: PCB footprint](/files/29cfe5266c7e26d37bdf1b2a0023449a2f39bbce) *Figure 12: PCB footprint* ## 7 Certification ### 7.1 FCC The MM8108-MF15457 has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: * Reorient or relocate the receiving antenna * Increase the separation between the equipment and receiver * Connect the equipment into an outlet on a circuit different from that to which the receiver is connected * Consult the dealer or an experienced radio/TV technician for help FCC caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. #### 7.1.1 FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance 20 cm between the radiator and your body. #### 7.1.2 Important Note To Integrators This module is intended for OEM integrators. It is only FCC authorized for the specific rule parts listed on the grant, and the host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Additional testing and certification may be necessary when multiple modules are used. #### 7.1.3 End Product User Manual Requirement In the user manual of the end product, the end user has to be informed to keep at least 20 cm of separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate this equipment. This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. #### 7.1.4 End Product Label Requirement The end product must be labeled in a visible area with the following: **Figure 13: End product label requirement** | Contains FCC ID: 2A74O-737B5B This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. | | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ | ### 7.2. IC This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil contient des émetteurs / récepteurs exempts de licence qui sont conformes au (x) RSS (s) exemptés de licence d’Innovation, Sciences et Développement économique Canada. L’opération est soumise aux deux conditions suivantes: (1) Cet appareil ne doit pas provoquer d'interférences. (2) Cet appareil doit accepter toute interférence, y compris les interférences susceptibles de provoquer un fonctionnement indésirable de l'appareil. This radio transmitter 29791-737B5B has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Le présent émetteur radio 29791-737B5B a été approuvé par Innovation, Sciences et Développement économique Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal d'antenne. Les types d'antennes non inclus dans cette liste qui ont un gain supérieur au gain maximal indiqué pour tout type listé sont strictement interdits pour une utilisation avec cet appareil. #### 7.2.1 IC Radiation Exposure Statement: This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. #### 7.2.2 Important Note To Integrators This module is intended for OEM integrators. The OEM integrator is responsible for complying with all the rules that apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessary when multiple modules are used. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. #### 7.2.3 End Product User Manual Requirement In the users manual of the end product, the end user has to be informed to keep at least 20 cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the IC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. Operation is subject to the following two conditions: (1) this device may not cause harmful interference (2) this device must accept any interference received, including interference that may cause undesired operation. #### 7.2.4 End Product Label Requirement The end product must be labeled in a visible area with the following: **Figure 14: End product label requirement** | Contains IC: 29791- 737B5B | | -------------------------- | The Host Model Number (HMN) must be indicated at any location on the exterior of the end product, product packaging, or product literature, which shall be available with the end product or online. ## 8 Part Numbers and Ordering Information **Table 14: Part number and ordering information** | Part Number | Packing Type | MOQ and Order Multiples | Part Size (mm) | Description | | -------------- | ------------ | ----------------------- | -------------- | ------------------------------------------------------ | | MM8108-MF15457 | Tray | 100 | 10 x 11 x 2 | IEEE 802.11ah Sub-1 GHz 1/2/4/8 MHz Wi-Fi HaLow Module | ## 9 Handling and Storage The MM8108-MF15457 module is a moisture-sensitive device rated at Moisture Sensitive Level 3 (MSL3) per IPC/JEDEC J-STD-20. After opening the moisture-sealed storage bag, modules that will be subjected to reflow solder or other high-temperature processes must be: 1. Mounted to a circuit board within 168 hours at factory conditions (≤30°C and <60% RH), OR 2. Continuously stored per IPC/JEDEC J-STD-033 Modules exposed to moisture and environmental conditions exceeding packaging and storage conditions MUST be baked before mounting, according to IPC/JEDEC J-STD-033. Failure to meet packaging and storage conditions will result in irreparable damage to modules during the solder reflow process. ## 10 Revision History | Release Number | Release Date | Release Notes | | -------------- | ------------ | ----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- | | Version 4 | 30 Sep 2025 | Updated pin descriptions Updated host interface schematic designs | | Version 3 | 18 Sep 2025 | Updated formatting Added USB dongle reference design Updated power management Updated timing graphs Updated electrical specifications Updated RF specifications Added digital IO specifications | | DS101 | 28 Feb 2025 | Added power on and reset timing details Updated standby power consumption | | DS100 | 8 Jan 2025 | Initial release | Morse Micro provides this information "as is" without warranties of any kind, express or implied. No guarantee is made as to the accuracy, completeness, or suitability of this information or Morse Micro’s products for any specific purpose. Use of this information and products is at the user’s sole risk. Morse Micro products are not designed or tested for use in mission-critical systems, and should not be used in such applications. Performance specifications are based on internal testing and are believed to be reliable; however, they are not guaranteed. It is the Buyer’s responsibility to test and validate all product performance, compatibility, and compliance, both in isolation and within end applications. Morse Micro assumes no liability for the use or application of any product, circuit, or information described herein. No license or other rights—express or implied—are granted under Morse Micro’s intellectual property. This document contains proprietary information of Morse Micro and is subject to change without notice. Wi-Fi®, Wi-Fi HaLow™, and the Wi-Fi logo are trademarks of Wi-Fi Alliance. ZigBee™ and Z-Wave™ are trademarks of their respective owners. All other trademarks are the property of their respective owners.